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CN/EN

產品與市場

SI10U

特點

● 低CTE,高模量,可有效降低封裝基板的翹曲
優異的耐濕熱性
良好的PCB加工性
無鹵材料


應用領域

● Memory, CSP, BGA, POP類封裝載板
  • 產品性能
  • 產品證書
  • 資料下載
Items Condition Unit SI10U SI10U LC
Tg DMA 270 270
Td 5% wt. loss
>400 >400
T300
TMA min >60 >60
CTE (X/Y-axis) Before Tg ppm/℃
10 7
Dissipation Constant (1GHz) 2.5.5.9 - 4.6 4.2
Dissipation Factor (1GHz)
2.5.5.9 - 0.006 0.006
Peel Strength 12 um LP N/mm
0.8 0.8
Flexural Modulus A GPa
30 32
Water Absorption C-168/85/85 %
0.35 0.35
Flammability
UL-94 Rating
V-0 V-0
Heat Resistance 300℃/solder dip s
>300 >300
Heat Resistance after Moisture absorption
PCT 5h+288℃solder 20s
- Pass Pass
Halogen free
- - Yes
Yes
Glass
- - E glass Low CTE-glass

Remarks:

1. These properties were measured with 0.80mm laminates except for XY-CTE that was measured with 0.10mm laminates.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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